Package structure and package process
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United States of America Patent
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Dec 23, 2014
Issued Date -
N/A
app pub date -
Jul 20, 2011
filing date -
Jul 20, 2011
priority date (Note) -
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Abstract
A package structure and a package process are provided. The package structure comprises a carrier having a carrying portion and a plurality of supporting bar remnants disposed around and extending outward from the carrying portion, a chip mounted to the carrying portion, and an encapsulant disposed on the carrier and covering the chip, wherein the supporting bar remnants are encapsulated by the encapsulant, and each of the supporting bar remnants has a distal end shrank from an outer surface of the encapsulant. A package process for fabricating the package structure is also provided.
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