Semiconductor modules and methods of formation thereof
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United States of America Patent
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Dec 23, 2014
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app pub date -
Feb 18, 2013
filing date -
Feb 18, 2013
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Abstract
In accordance with an embodiment of the present invention, a semiconductor module includes a first semiconductor package having a first semiconductor die, which is disposed in a first encapsulant. An opening is disposed in the first encapsulant. A second semiconductor package including a second semiconductor die is disposed in a second encapsulant. The second semiconductor package is disposed at least partially within the opening in the first encapsulant.
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