Pattern forming method
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United States of America Patent
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Dec 23, 2014
Grant Date -
Mar 28, 2013
app pub date -
Jun 20, 2012
filing date -
Sep 26, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A pattern forming method according to an embodiment includes: forming a pattern film on a first substrate, the pattern film having a concave-convex pattern, the pattern film being made of a material containing a first to-be-imprinted agent; forming a material film on a second substrate, the material film containing a second to-be-imprinted agent having a higher etching rate than an etching rate of the first to-be-imprinted agent; transferring the concave-convex pattern of the pattern film onto the material film by applying pressure between the first substrate and the second substrate, with the pattern film being positioned to face the material film, and by curing the second to-be-imprinted agent; detaching the first substrate from the pattern film; and removing the material film by etching, to leave the pattern film on the second substrate.
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International Classification(s)
- B41M:PRINTING, DUPLICATING, MARKING, OR COPYING PROCESS....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- B44C:PRODUCING DECORATIVE EFFECTS
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