Semiconductor chip with integrated via

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United States of America Patent

PATENT NO 8912654
SERIAL NO

12101501

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Abstract

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An integrated circuit with a substrate with a lower and an upper surface is described. A via extends between the upper and the lower surface of the substrate. The via contains a conductive filling material that comprises carbon.

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Patent Owner(s)

Patent OwnerAddress
POLARIS INNOVATIONS LIMITED29 EARLSFORT TERRACE DUBLIN 2 DUBLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hedler, Harry Germering, DE 122 2393
Kreupl, Franz Munich, DE 76 2235

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