Semiconductor chip with integrated via

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United States of America Patent

PATENT NO 8912654
SERIAL NO

12101501

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Abstract

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An integrated circuit with a substrate with a lower and an upper surface is described. A via extends between the upper and the lower surface of the substrate. The via contains a conductive filling material that comprises carbon.

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Patent Owner(s)

Patent OwnerAddress
POLARIS INNOVATIONS LIMITED29 EARLSFORT TERRACE DUBLIN 2 DUBLIN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hedler, Harry Germering, DE 122 2393
Kreupl, Franz Munich, DE 76 2235

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Patent Citation Ranking

  • 2 Citation Count
  • H01L Class
  • 7.09 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges7625916189582342423416712683684320001 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0500100015002000250030003500400045005000550060006500

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