IC package with embedded transformer
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United States of America Patent
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Dec 16, 2014
Issued Date -
N/A
app pub date -
Jun 7, 2012
filing date -
Mar 28, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.
First Claim
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- H02M:APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEE....
- G01L:MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL ....
- H04B:TRANSMISSION
- G01P:MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, D....
- G05F:SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIAB....
- H01F:MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF M....
- H01H:ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PR....
- H03J:TUNING RESONANT CIRCUITS; SELECTING RESONANT CIRCU....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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