Substrate, method of producing substrate, superconducting wire, and method of producing superconducting wire

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United States of America Patent

PATENT NO 8912126
SERIAL NO

13381109

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Abstract

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A substrate of the present invention includes a copper layer, an alloy layer containing copper and nickel, formed on the copper layer, a nickel layer formed on the alloy layer, and an intermediate layer formed on the nickel layer. The concentration of nickel in the alloy layer at the interface between the alloy layer and the nickel layer is greater than the concentration of nickel in the alloy layer at the interface between the alloy layer and the copper layer. According to the present invention, there can be provided a substrate that allows the AC loss of a superconducting wire to be reduced, a method of producing a substrate, a superconducting wire, and a method of producing a superconducting wire.

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Patent Owner(s)

Patent OwnerAddress
TOYO KOHAN CO LTD2-18-1 HIGASHI-GOTANDA SHINAGAWA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konishi, Masaya Osaka, JP 43 231
Ota, Hajime Osaka, JP 55 188
Yamaguchi, Takashi Osaka, JP 510 6413

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