Sputtering apparatus, sputtering method, and electronic device manufacturing method
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United States of America Patent
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Dec 9, 2014
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app pub date -
May 10, 2011
filing date -
Dec 26, 2008
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Abstract
A sputtering apparatus includes a substrate holder which holds a substrate to be rotatable in the plane direction of the processing surface of the substrate, a substrate-side magnet which is arranged around the substrate and forms a magnetic field on the processing surface of the substrate, a cathode which is arranged diagonally above the substrate and receives discharge power, a position detection unit which detects the rotational position of the substrate, and a controller which controls the discharge power in accordance with the rotational position detected by the position detection unit.
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