Surface mount device thin package
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United States of America Patent
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Dec 2, 2014
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app pub date -
Apr 12, 2010
filing date -
Apr 12, 2010
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Abstract
The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
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