Method for producing water-absorbent resin particles and water-absorbent resin particles

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United States of America Patent

PATENT NO 8900707
APP PUB NO 20130260151A1
SERIAL NO

13878616

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Abstract

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The present invention provides a method for producing water-absorbent resin particles which show an excellent water absorption rate and high equilibrium swelling capacity and which have an appropriate particle size to be excellent in handleability, and water-absorbent resin particles obtained by the method. The present invention is a method for producing water-absorbent resin particles by reversed phase suspension polymerization of a water-soluble ethylenically unsaturated monomer, the method including the steps of: (A) first reversed phase suspension polymerization of a water-soluble ethylenically unsaturated monomer in a petroleum hydrocarbon dispersion medium using a water-soluble radical polymerization initiator, in the absence of an internal crosslinking agent and in the presence of a surfactant having an HLB of 8 to 12; (B) intermediate crosslinking reaction by adding an intermediate crosslinking agent; (C) second reversed phase suspension polymerization of a water-soluble ethylenically unsaturated monomer added to the petroleum hydrocarbon dispersion medium containing the surfactant dissolved therein using a water-soluble radical polymerization initiator in the absence of an internal crosslinking agent, thereby producing a water-absorbent resin precursor; and (D) post crosslinking reaction of the water-absorbent resin precursor preliminary adjusted to have a moisture content of 30 to 100% by mass relative to a water-soluble ethylenically unsaturated monomer component in the water-absorbent resin precursor.

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  • SUMITOMO SEIKA CHEMICALS CO., LTD.

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  • 2010 Application Filing Year
  • B32B Class
  • 4989 Applications Filed
  • 2308 Patents Issued To-Date
  • 46.27 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201020112012201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heguri, Atsushi Himeji, JP 9 26
Onoda, Yuichi Himeji, JP 19 75
Tanimura, Kenji Himeji, JP 17 82

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4502135526165743517121144701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +010020030040050060070080090010001100120013001400150016001700180019002000210022002300

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