LED package and method of making the same
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United States of America Patent
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Nov 25, 2014
Issued Date -
N/A
app pub date -
Jun 27, 2011
filing date -
Jun 25, 2010
priority date (Note) -
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Abstract
LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.
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