Family

Loading Family data...

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
INSERM (INSTITUT NATIONAL DE LA SANTE ET DE LA RECHERCHE MEDICALE)	101 RUE DE TOLBIAC PARIS 75013
AGRO INDUSTRIE RECHERCHES ET DEVELOPPEMENTS A R D	ROUTE DE BAZANCOURT POMACLE F-51110

International Classification(s)

• A61K:PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOS....
• A61P:THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDI....
• A61Q:USE OF COSMETICS OR SIMILAR TOILET PREPARATIONS

• 2008 Application Filing Year
• A61K Class
• 9711 Applications Filed
• 5862 Patents Issued To-Date
• 60.37 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bresin, Anthony	Saint Masmes, FR	3	24
# of filed Patents : 3 Total Citations : 24
Milliot, Magali	Reims, FR	1	14
# of filed Patents : 1 Total Citations : 14
Puchelle, Edith	Tauriac, FR	5	105
# of filed Patents : 5 Total Citations : 105
Zahm, Jean-Marie	Reims, FR	3	53
# of filed Patents : 3 Total Citations : 53

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

• 10 Citation Count
• A61K Class

• 21.20 % this patent is cited more than
• 11 Age

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	May 25, 2026

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 25, 2014	US,8895532,B2   US8895532B2	GRANTED PATENT AS SECOND PUBLICATION
August 19, 2010	US,20100210585,A1   US20100210585A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2008/0261,071

Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components

---

Abstract

---

A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.

---

 

---

Description

---

Claims

---

Claims data not available

---

Legal Events

• No Legal Status data available.