Method of forming channel layer of electric device and method of manufacturing electric device using the same
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United States of America Patent
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Nov 25, 2014
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Sep 14, 2012
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Sep 14, 2012
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Abstract
A method of forming a channel layer of an electric device according to an embodiment is provided. First, a conductive substrate including an insulating layer on the substrate is provided. The conductive substrate and a metal to be plated are used as respective electrodes to carry out electroplating within an electrolyte solution. In this case, electrons provided by a tunneling current passing through the insulating layer from the conductive substrate are bonded with ions of the metal within the electrolyte solution to form a metal channel layer on the insulating layer.
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