Method for creating semiconductor junctions with reduced contact resistance
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United States of America Patent
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Nov 25, 2014
Issued Date -
N/A
app pub date -
Oct 4, 2012
filing date -
Oct 25, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the invention relate generally to creating semiconductor junctions with reduced contact resistance. In one embodiment, the invention provides a method of forming a composition of material, the method comprising: providing at least two populations of semiconducting materials; layering the at least two populations of semiconducting materials to form at least two layers; and consolidating the at least two populations of semiconducting materials, wherein the consolidating creates an electrical connection between the at least two layers.
First Claim
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| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| US | B2 | US8999822 | Nov 03, 2014 |
International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 11 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 25, 2026 |
