Method and apparatus for preparing fold lines
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United States of America Patent
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Nov 25, 2014
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app pub date -
Sep 18, 2009
filing date -
Oct 20, 2008
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Abstract
The method and the apparatus are used for preparing fold lines on laminated materials on the basis of cardboard. At least one region intended for providing the fold line is subjected to heat such that an at least partial local reduction of shear fracture stresses of the material is produced in said region. The application of heat is done using a heating device, which is disposed adjacent to a guide device for the laminate. The local reduction of the shear fracture stresses supports local delamination, which supports the formation of a folding joint.
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