Thermoplastic molding compounds based on styrene copolymers and polyamides having improved weathering resistance

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United States of America Patent

PATENT NO 8889767
SERIAL NO

13148399

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Abstract

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The thermoplastic molding composition comprises

    a) as component A, from 3 to 78% by weight of one or more styrene copolymers which have no units derived from maleic anhydride,b) as component B, from 15 to 90% by weight of one or more polyamides,c) as component C, from 5 to 50% by weight of one or more impact-modifying graft rubbers without olefinic double bonds in the rubber phase,d) as component D, from 1 to 25% by weight of one or more styrene copolymers which have, based on the entire component D, from 0.5 to 5% by weight of units derived from maleic anhydride,e) as component E, from 1 to 30% by weight of one or more further rubbers based on olefinic monomers without core-shell structure, and having at least 0.1% by weight of functional monomers,f) as component F, from 0 to 50% by weight of one or more fibrous or particulate fillers,g) as component G, from 0 to 40% by weight of further additives,where the entire amount of components A to E and, if appropriate, F and G is 100% by weight.

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Patent Owner(s)

Patent OwnerAddress
STYROLUTION EUROPE GMBH60325 FRANKFURT AM MAIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blinzler, Marko Mannheim, DE 18 73
Schneidereit, Christoph Ludwigshafen, DE 1 10
Schweiger, Christian Wilhelmsfeld, DE 7 51
Weber, Martin Maikammer, DE 270 2113

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