Packaging device and base member for packaging

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8884165
APP PUB NO 20110108308A1
SERIAL NO

13002562

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Abstract

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An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate having a plurality of through electrodes arranged at a predetermined position is used as a base member for a package that houses a device element having a group of electrodes, and the group of electrodes and the through electrodes are led out to an external circuit with a contact medium arranged to bypass a sealant being interposed between the group of electrodes and the through electrodes.

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Patent Owner(s)

Patent OwnerAddress
SCHOTT JAPAN CORPORATION3-1 NICHIDEN MINAKUCHI-CHO KOKA-SHI SHIGA 528-0034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamada, Hiroshi Koka, JP 78 2168

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