Stress-relief elastic structure of hairspring collet

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8882341
APP PUB NO 20140198627A1
SERIAL NO

14154055

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A hairspring collet for a hairspring for interference engagement and an interference fit with the cylindrical outer surface of the staff of a balance wheel for a timepiece movement, the hairspring collet portion comprising a plurality of circumferentially extending elastically deformable interconnected arm portions, the arm portions forming an annulus having a central axis and providing an aperture therebetween, wherein each arm portion including a curved concave engagement portion for engagement with the outer surface of a staff of a balance wheel, wherein each engagement portion has substantially the same radius of curvature as each other and are equally spaced from the central axis at a first distance and wherein the first distance is less than the radius of the staff of the balance wheel; the engagement portions have a radius of curvature such that upon deformation of the arm portions and engagement with the outer surface of the staff the engagement portions substantially conform with the outer surface of the staff and an interference fit is formed therebetween, wherein stress induced from said interference fit is transferred and distributed from along the engagement portions to the arm portions adjacent the engagement portions and distributed therein; and wherein the interference fit of the engagement portions with the staff substantially prevents relative movement between the hairspring collet and the staff of the balance wheel upon application of load from a hairspring in use in a timepiece movement.

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Patent Owner(s)

Patent OwnerAddress
MASTER DYNAMIC LIMITEDUNIT 108B-109 1/F BIOTECH CENTRE 1 NO 9 SCIENCE PARK WEST AVENUE SHATIN NEW TERRITORIES

International Classification(s)

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  • 2014 Application Filing Year
  • G04B Class
  • 214 Applications Filed
  • 202 Patents Issued To-Date
  • 94.40 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ching, Ho Shatin, HK 8 39
Chu, Siu Kay Shatin, HK 1 8
Ko, Pui Hang Shatin, HK 4 17

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Patent Citation Ranking

  • 5 Citation Count
  • G04B Class
  • 7.23 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1211122122321101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 70100 +05101520253035404550556065707580859095100105110115120

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11.5 Year Payment $7400.00 $3700.00 $1850.00 May 11, 2026