Cutter wheel, manufacturing method for same, manual scribing tool and scribing device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8881633
SERIAL NO

11572154

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 μm.

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Patent Owner(s)

Patent OwnerAddress
MITSUBOSHI DIAMOND INDUSTRIAL CO LTDOSAKA JAPAN OSAKA

International Classification(s)

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  • 2005 Application Filing Year
  • B28D Class
  • 71 Applications Filed
  • 45 Patents Issued To-Date
  • 63.39 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20052006200720082009201020112012201320142015201620170255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ogasawara, Noriyuki Iida, JP 16 64
Sekijima, Takashi Iida, JP 2 2
Shiozawa, Tetsuji Iida, JP 2 2
Soyama, Hiroshi Ibaraki, JP 12 84
Wakayama, Haruo Suita, JP 12 104

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Patent Citation Ranking

  • 0 Citation Count
  • B28D Class
  • 0 % this patent is cited more than
  • 11 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1051651101 - 1011 - 2021 - 3081 - 9091 - 10002.557.51012.51517.52022.52527.53032.53537.54042.54547.55052.555

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11.5 Year Payment $7400.00 $3700.00 $1850.00 May 11, 2026