Flexible circuit assembly and method thereof
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United States of America Patent
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Nov 4, 2014
Grant Date -
Dec 20, 2012
app pub date -
Mar 27, 2012
filing date -
Jun 15, 2011
priority date (Note) -
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Abstract
An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.
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