MEMS devices

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United States of America Patent

PATENT NO 8872359
APP PUB NO 20120091561A1
SERIAL NO

13378240

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Abstract

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A method of manufacturing a MEMS device comprises forming a MEMS device element (12). A sidewall (20) is formed around the MEMS device element, and a sacrificial layer (14) is formed over the device element and within the sidewall. A package cover layer (16) is provided over the sacrificial layer, and the sacrificial layer is removed. This method provides additional sidewalls to the cap provided over the MEMS device. These additional sidewalls can then be deposited by a different process and be formed of a different material to the top part of the package cover layer. The sidewalls can prevent reflow of the sacrificial layer and improve the sealing properties of the sidewalls.

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Patent Owner(s)

Patent OwnerAddress
MORGAN STANLEY SENIOR FUNDING INC1300 THAMES STREET 4TH FLOOR BALTIMORE MD 21231

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Van, Velzen Bart Arnhem, NL 4 21
Van, Zadelhoff Hans Andelst, NL 1 8
Verheijden, Greja Johanna Adriana Maria Riethoven, NL 14 208

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