Wafer dicing press and method and semiconductor wafer dicing system including the same
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United States of America Patent
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Oct 28, 2014
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app pub date -
Dec 23, 2011
filing date -
Feb 1, 2011
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Abstract
In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.
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