Microcapsules having a radiation-induced or thermal release
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United States of America Patent
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Oct 21, 2014
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app pub date -
Mar 9, 2009
filing date -
Mar 11, 2008
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Abstract
The present invention relates to microcapsules comprising a capsule core comprising a lipophilic substance and also at least one compound which absorbs electromagnetic radiation from the wavelength range from 700 nm to 1 m, and a capsule wall synthesized from
- 40 to 80% by weight of one or more monomers (monomers I) selected from C1-C24 alkyl esters of acrylic and/or methacrylic acid, acrylic acid, methacrylic acid, and maleic acid,20 to 60% by weight of one or more di- or polyfunctional monomers (monomers II) which are sparingly soluble or insoluble in water, and0 to 40% by weight of one or more other monomers (monomers III),based in each case on the total weight of the monomers,and also to microcapsules comprising at least one epoxy tackifier resin and if desired a compound which absorbs electromagnetic radiation from the wavelength range from 700 nm to 1 m, to a process for preparing them, to their use in pressure sensitive adhesives, and also to a method of adhesively bonding at least two substrates.
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