Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies
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United States of America Patent
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Oct 21, 2014
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app pub date -
Aug 9, 2011
filing date -
Apr 30, 2010
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Abstract
Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly.
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