Integrated circuit package and a method for dissipating heat in an integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 14, 2014
Issued Date -
N/A
app pub date -
Dec 12, 2006
filing date -
Dec 12, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An IC package that is suitable for surface mounting arrangements includes a heat spreader device that is coupled to a bottom portion of the package below the IC die. Coupling the heat spreader device to the bottom portion of the package reduces or eliminates the possibility that placement of the heat spreader device will result in the molding compound bleeding on top of the heat spreader device, and delamination at the footings of the heat spreader device that can cause the package to delaminate, or “popcorn”.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully