Entrainment heat sink devices
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United States of America Patent
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Oct 14, 2014
Grant Date -
May 24, 2012
app pub date -
Nov 24, 2010
filing date -
Nov 24, 2010
priority date (Note) -
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Abstract
Entrainment heat sink devices and methods of forming entrainment heat sink devices are described herein. One or more method embodiments include forming an opening through a first material, forming a dimple having a trapezoidal-cross section in the first material such that the opening is located on a side wall of the trapezoidal cross-section, and attaching the first material to a second material, wherein the first material or the second material has a trench formed therein and the first material is attached to the second material such that the trench is in fluidic communication with the dimple.
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