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United States of America Patent
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Oct 7, 2014
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N/A
app pub date -
Apr 8, 2013
filing date -
Aug 26, 2011
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Abstract
Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.
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