Method of manufacturing lead frame for light-emitting device package and light-emitting device package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 30, 2014
Grant Date -
Sep 13, 2012
app pub date -
Mar 9, 2012
filing date -
Mar 10, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a lead frame for a light-emitting device package and a light-emitting device package are provided. The method of manufacturing a lead frame for a light-emitting device package includes: preparing a base substrate for the lead frame; forming diffusion roughness on the base substrate; and forming a reflective plating layer on the diffusion roughness formed base substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully