Process for producing transparent conductive transfer plate, transparent conductive transfer plate, process for producing transparent conductive substrate using the transparent conductive transfer plate, transparent conductive substrate, and molded product using the transparent conductive substrate
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United States of America Patent
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Sep 30, 2014
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app pub date -
Jun 30, 2009
filing date -
Jul 4, 2008
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Abstract
A transparent conductive substrate capable of readily producing a transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property without using a special apparatus and can be applied to production of various extensive substrates by applying a dispersion solution of metal fine particles capable of forming a self-organized film on a support, drying the obtained coating layer and then subjecting the resulting dried material to heat treatment and/or chemical treatment particles on a support, drying the obtained coating layer and then reducing and precipitating the precursor of the metal fine particles, to previously form a transparent conductive film; and then bonding a substrate to the support to transfer the transparent conductive film onto the substrate and releasing the support from the transparent conductive film.
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