Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same

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United States of America Patent

PATENT NO 8846159
APP PUB NO 20130045336A1
SERIAL NO

13592978

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Abstract

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The disclosed mold includes recessed parts which have a shape corresponding to embossed portions of the barrier rib to be fabricated, and protruding parts which have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered. The protruding parts and the recessed parts are arranged at regular intervals. It is possible to simply fabricate the two-layered barrier rib for inkjet application through a single embossing process at low cost using the mold for fabricating the barrier rib of the present invention.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Han Sol Yongin-si, KR 13 34
Park, Joon Yong Yongin-si, KR 80 566
Park, Yong Young Suwon-si, KR 6 35
Son, Young Mok Hwaseong-si, KR 10 36

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