Substrate damage prevention system and method
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United States of America Patent
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Sep 30, 2014
Issued Date -
N/A
app pub date -
Oct 18, 2007
filing date -
Dec 11, 2006
priority date (Note) -
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Abstract
A substrate damage prevention system and method for a plasma treating apparatus are provided. The system may include a lower electrode on which a substrate may be mounted, an inert gas supply unit which may supply an inert gas to an upper surface of the lower electrode on which the substrate is mounted, and an air supply unit which may supply air to the upper surface of the lower electrode. An inert gas may be supplied between the lower electrode and the substrate in order to control the temperature of the substrate during the chucking. Air may be supplied between the lower electrode and the substrate during dechucking in order to allow the substrate to be easily separated from the lower electrode.
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