On-die programming of integrated circuit bond pads
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United States of America Patent
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Sep 23, 2014
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app pub date -
Feb 26, 2013
filing date -
Feb 26, 2013
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Abstract
SoC and SiP designs are configured with an antifuse link within the die to allow on-die programming of bond wires connecting package lead fingers to the bond pads on the die. This permits alteration of the bond pad connections for the die, particularly for the ground voltage ground signal (VSS) connections on the bond pad, at the testing stage after the die package and the power supply have been installed on the PCB. On-die programming of antifuse link allows the VSS bond pad connections to be reconfigured, typically to eliminate long bond wire runs to reduce ground bounce and simultaneous switching output (SSO) noise, after assembly and field testing of the integrated circuit. Antifuse programming is completed by applying the programming voltage to the programming pad of the antifuse.
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