Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film

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United States of America Patent

PATENT NO 8841064
SERIAL NO

13294223

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Abstract

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Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same.

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Patent Owner(s)

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CHEIL INDUSTRIES INCGYEONGBUK SOUTH KOREA CHUNGCHEONGBUK-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cha, Myoung-Hwan Uiwang-si, KR 9 44
Cheon, Hwan-Sung Uiwang-si, KR 44 240
Cho, Hyun-Yong Uiwang-si, KR 20 63
Chung, Min-Kook Uiwang-si, KR 11 47
Im, Mi-Ra Uiwang-si, KR 7 16
Jeong, Ji-Young Uiwang-si, KR 50 284
Lee, Jong-Hwa Uiwang-si, KR 104 1238

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