Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate
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United States of America Patent
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Sep 9, 2014
Grant Date -
Feb 7, 2013
app pub date -
Sep 22, 2011
filing date -
Aug 4, 2011
priority date (Note) -
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Abstract
Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.
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