Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same
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United States of America Patent
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Sep 9, 2014
Grant Date -
Mar 21, 2013
app pub date -
Aug 20, 2012
filing date -
Sep 21, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a method of manufacturing a circuit which includes: (a) providing a substrate made of a conductive material; (b) etching a first surface of the substrate excluding a region in which at least one via is to be formed; (c) etching a region of the etched first surface of the substrate in which an insulated portion of a first circuit is to be formed; (d) stacking a first insulation layer in spaces formed by the etching performed in operations (b) and (c); and (e) grinding a second surface of the substrate to expose the first insulation layer outward along with the first circuit, thereby forming a circuit board.
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