Electrode forming apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8826518
SERIAL NO

13011245

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The invention aims at reducing unevenness at the intersections of mutually crossing electrodes with a method of and an apparatus for forming electrodes on a substrate. After forming a number of finger electrodes on a substrate, wide bus electrodes intersecting them are formed by application of an application liquid. Upon applying the application liquid which contains an electrode material and a photo-curing resin to the substrate, the application liquid is irradiated with UV light after a predetermined time and the application liquid is thus made to harden. A time difference since applying until light irradiation is set based on the result of measurement on changes of the height of the application liquid experimentally applied.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTDKYOTO JAPAN KYOTO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sanada, Masakazu Kyoto, JP 51 579

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 9, 2026
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00