Wafer unloading system and wafer processing equipment including the same
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United States of America Patent
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Sep 2, 2014
Grant Date -
Jul 21, 2011
app pub date -
Jan 18, 2011
filing date -
Jan 15, 2010
priority date (Note) -
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Abstract
A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.
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