Method and apparatus for printing a substrate, in particular a printed circuit board, with a printing paste
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United States of America Patent
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Sep 2, 2014
Grant Date -
Sep 13, 2012
app pub date -
Oct 12, 2010
filing date -
Nov 6, 2009
priority date (Note) -
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Abstract
The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).
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