Method and apparatus for drilling using a series of laser pulses
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United States of America Patent
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Aug 26, 2014
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app pub date -
May 4, 2011
filing date -
May 4, 2010
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Abstract
A series of laser pulses, each pulse characterized by one or more predetermined pulse characteristics including wavelength, pulse energy, inter-pulse time interval, pulse width or pulse shape, is provided to drill a hole in a material. Drilling the hole in the material is achieved by placing the series of laser pulse spots at the location wherein the hole is to be drilled. One or more characteristics of one or more laser pulses in the series is changed in order to optimize the drilling process for the hole. The ability to change the characteristics of one or more laser pulses in the series of pulses to optimize the drilling process results in holes with desired attributes and a high drilling rate.
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