Polyimides and fluoropolymer bonding layer with improved copper heat seal strength
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United States of America Patent
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Aug 26, 2014
Grant Date -
Jun 21, 2012
app pub date -
Aug 31, 2010
filing date -
Sep 1, 2009
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Abstract
Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superior internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described.
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