Wafer-to-wafer stack with supporting pedestal
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United States of America Patent
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Aug 19, 2014
Grant Date -
Jun 30, 2011
app pub date -
Dec 30, 2010
filing date -
Oct 26, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.
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