Process and apparatus for ablation

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8809732
APP PUB NO 20130140287A1
SERIAL NO

13720009

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Abstract

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An ablation method including a steps of ablating a region of a substrate (1) by a laser beam (3); and removing debris ablated from the region (1) by a flow of a fluid (7), namely, a gas or vapor, a liquid or a combination of the fluids. The flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter remove the entrapped debris from the region by directing the flow of fluid, with any entrapped debris, away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO
TEL SOLAR AG9477 TRÜBBACH

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aso, Kosei Tokyo, JP 8 83
Murase, Hidehisa Tokyo, JP 13 129
Sasaki, Yoshinari Tokyo, JP 27 289
Sykes, Neil Yarnton, GB 7 53
Yamada, Naoki Tokyo, JP 428 4961

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