Method for manufacturing conductive adhesive containing one-dimensional conductive nanomaterial
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United States of America Patent
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Aug 19, 2014
Grant Date -
Jan 5, 2012
app pub date -
Jun 30, 2010
filing date -
Jun 30, 2010
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Abstract
A method for manufacturing a conductive adhesive containing a one-dimensional (1D) conductive nanomaterial is revealed. The method produces a conductive adhesive by mixing the 1D conductive nanomaterial with water-based or solvent-based resin solution. The conductive adhesive has good industrial applications, not influenced by industrial adaptability and environmental adaptability. The conductive adhesive obtained also has better conductivity. Moreover, the amount of the 1D conductive nanomaterial used in the present invention is less than the amount of conductive nanoparticles used and the cost is reduced effectively.
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