Method of manufacturing semiconductor package having no chip pad
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United States of America Patent
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Aug 12, 2014
Grant Date -
Nov 28, 2013
app pub date -
Mar 18, 2013
filing date -
May 24, 2012
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor package having no chip pad includes preparing a polyimide tape on which an adhesive layer is arranged; forming lead members on the adhesive layer so as to form a plurality of semiconductor packages in a matrix form; attaching the polyimide tape to a carrier; performing wire bonding to mount semiconductor chips on the polyimide tape and connect the lead members and the semiconductor chips; forming an encapsulation member to encapsulate the semiconductor chips, the lead members, and wires; detaching the encapsulation member from the carrier and the polyimide tape; forming conductive layers each on a surface of the lead member exposed through a surface of the encapsulation member; and performing a singulation process on the encapsulation member with the conductive layers formed thereon to define unit semiconductor packages.
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