Titanium etchant composition and method of forming a semiconductor device using the same

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United States of America Patent

PATENT NO 8801958
APP PUB NO 20110240912A1
SERIAL NO

13075430

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Abstract

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A titanium etchant composition and a method of forming a semiconductor device using the same, the titanium etchant composition including a titanium remover; a corrosion inhibitor; and a deionized water; wherein the corrosion inhibitor includes 5-aminotetrazole.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677
SAMYOUNG PURE CHEMICALS CO LTD22 5SANDAN 1-RO SEONGNAM-MYEON DONGNAM-GU CHUNGCHEONGNAM-DO CHEONAN-SI 31245

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Seunghyun Suwon-si, KR 9 19
Cho, Kyoochul Yongin-si, KR 5 11
Choi, Baiksoon Gyeonggi-do, KR 4 5
Jeon, JungIg Ulsan, KR 1 3
Kang, Dong-Min Seoul, KR 45 305
Kwon, Jeong Ulsan, KR 3 3
Park, Heon jin Suwon-si, KR 1 3

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