Epoxy-rubber composition for cured materials
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United States of America Patent
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Aug 5, 2014
Grant Date -
May 24, 2012
app pub date -
Nov 24, 2010
filing date -
Nov 24, 2010
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Abstract
The invention relates to an epoxy/rubber composition comprising an epoxy resin which comprises an epoxy compound X, the epoxy compound X has epoxy equivalent weight (EEW) from 150 up to 200 and viscosity from 2,000 up to 10,000 cps (25 C), a curing agent, a liquid rubber that is liquid at room temperature and comprises at least 1.5 reactive terminated group, a fluorine contained organic matter, selected from a group, including
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