Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier
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United States of America Patent
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Aug 5, 2014
Grant Date -
Nov 14, 2013
app pub date -
Jul 24, 2013
filing date -
Feb 15, 2008
priority date (Note) -
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Abstract
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.
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