Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board
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United States of America Patent
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Jul 29, 2014
Grant Date -
Nov 15, 2012
app pub date -
Jun 22, 2012
filing date -
May 4, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blind vias are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. With this methodology a resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.
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