Cutting liquid supply device for machine tool
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jul 29, 2014
Grant Date -
Apr 5, 2012
app pub date -
Apr 9, 2010
filing date -
May 27, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A cutting liquid supply device in a machine tool is configured to remove gas mixed in a cutting liquid supply line to improve the response of discharging a mist of cutting liquid. Cutting liquid is supplied from a pump (42) through a rotary joint (28) to a mist generation device (24) within a rotating spindle (29). The pressure of the cutting liquid is measured by a pressure sensor (47). An air vent device (30) for opening and closing, with respect to atmospheric pressure, piping (3) that supplies the cutting liquid is provided above the rotary joint (28). A detection signal is inputted in the control board (70) from the pressure sensor (47), and when the control board (70) detects, after the pump (42) stops the supply of the cutting liquid to the piping (3), that the pressure of the cutting liquid does not decrease to a level lower than a predetermined threshold value, the control board (70) instructs the air vent device (30) to open the piping (4) to the atmosphere.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HORKOS CORP | 2-24-20 KUSADO-CHO FUKUYAMA-SHI HIROSHIMA 720-8650 |
International Classification(s)

- 2010 Application Filing Year
- B23Q Class
- 438 Applications Filed
- 246 Patents Issued To-Date
- 56.17 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ikeda, Kunihiro | Fukuyama, JP | 7 | 36 |
# of filed Patents : 7 Total Citations : 36 | |||
Kawamoto, Takuya | Fukuyama, JP | 5 | 6 |
# of filed Patents : 5 Total Citations : 6 | |||
Kittaka, Sadaharu | Fukuyama, JP | 2 | 54 |
# of filed Patents : 2 Total Citations : 54 | |||
Maeda, Atsushi | Okazaki, JP | 123 | 1534 |
# of filed Patents : 123 Total Citations : 1534 | |||
Makiyama, Tadashi | Onomichi, JP | 19 | 152 |
# of filed Patents : 19 Total Citations : 152 | |||
Takeda, Shinya | Fukuyama, JP | 77 | 287 |
# of filed Patents : 77 Total Citations : 287 |
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Patent Citation Ranking
- 1 Citation Count
- B23Q Class
- 11.62 % this patent is cited more than
- 11 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 29, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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