Process for preparing, prior to filling, a wafer cornet, cornet thus obtained and installation for implementing the process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jul 29, 2014
Grant Date -
Sep 26, 2013
app pub date -
May 23, 2013
filing date -
Apr 9, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Process for preparing a cornet consisting of a substantially conical wafer (22) prior to filing of said cornet with an ice-cream; in order to preserve the crunchy nature of the wafer, the inner wall of the cornet is sprayed with liquid chocolate (23); this chocolate solidifies rapidly in order to form a coating layer for separating the wafer and the ice-cream. The process is characterized in that the inside of the cornet is sprayed with an excess quantity of chocolate to guarantee that no coating-gap zone remains on the inner wall of the wafer, the excess liquid chocolate collecting, under gravity, at the bottom tip of the corner, prior to solidification of said excess, the excess is sucked out of the cornet, subsequent solidification of the coating layer thus making it possible to establish a continuous barrier over the inner wall or the wafer.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SOCIETE DES PRODUITS NESTLE S A | SWITZERLAND ZUG ZUG |
International Classification(s)

- 2013 Application Filing Year
- B02B Class
- 9 Applications Filed
- 9 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Daouse, Alain | Noailles, FR | 17 | 405 |
# of filed Patents : 17 Total Citations : 405 | |||
Mange, Christian Jean Marie | Dublin, US | 3 | 5 |
# of filed Patents : 3 Total Citations : 5 |
Cited Art Landscape
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Patent Citation Ranking
- 1 Citation Count
- B02B Class
- 23.81 % this patent is cited more than
- 11 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 29, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Aug 19, 2019 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Aug 19, 2019 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jul 14, 2019 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Jul 14, 2019 |
Mar 04, 2019 | FEPP | FEE PAYMENT PROCEDURE | free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jul 14, 2015 | I | Issuance | |
Jun 24, 2015 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Nov 02, 2014 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
May 01, 2008 | P | Published | |
Apr 04, 2007 | F | Filing | |
Apr 03, 2007 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOI, SEONG JAE;CHOI, JAE YOUNG;JANG, EUN JOO;AND OTHERS;REEL/FRAME:019114/0602 Owner name: SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATION, KOR Effective Date: Apr 03, 2007 free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOI, SEONG JAE;CHOI, JAE YOUNG;JANG, EUN JOO;AND OTHERS;REEL/FRAME:019114/0602 Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF Effective Date: Apr 03, 2007 |
Oct 30, 2006 | PD | Priority Date |

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