Thermosetting composition and printed circuit board using the same

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Jul 22, 2014
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Sep 29, 2011
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Mar 15, 2011
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Mar 29, 2010

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Abstract

Disclosed are a thermosetting composition including a liquid crystal oligomer, a bismaleimide-based compound, an epoxy compound, and a fluorinated polymer resin powder. A resin cured product, board, and storage medium each include the thermosetting composition.

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SAMSUNG ELECTRO-MECHANICS CO LTD	GYEONGGI DO SOUTH KOREA

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Inventor Name	Address	# of filed Patents	Total Citations
Jung, Myung-Sup	Seongnam-si, KR	36	157
Lee, Jae-Jun	Suwon-si, KR	129	1268

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Thermosetting composition and printed circuit board using the same

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United States of America Patent

13048147

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PATENT NO	8784682
APP PUB NO	20110235292A1
SERIAL NO	13048147
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 22, 2014	US,8784682,B2 US8784682B2	GRANTED PATENT AS SECOND PUBLICATION
September 29, 2011	US,20110235292,A1 US20110235292A1	FIRST PUBLISHED PATENT APPLICATION

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13048147

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